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|
项 目 |
ITEM |
TECHNICAL PARAMETER |
|
层数 |
Layers |
1-30Layers |
|
板厚 |
Board Thickness |
0.2-6.0mm |
|
最小线宽 |
Min.Line Width |
0.075mm |
|
最小间距 |
Min.Space |
0.075mm |
|
最小孔径 |
Min.Hole Size |
0.15mm |
|
孔壁铜厚 |
PTH Wall Thickness |
>0.025mm |
|
金属化孔径公差 |
PTH Hole Dia.Tolerance |
±0.05mm |
|
非金属化孔径公差 |
Non PTH Hole Dia.Tolerance |
±0.025mm |
|
孔位公差 |
Hole Position Deviation |
±0.076mm |
|
外形尺寸公差 |
Outline Tolerance |
±0.1mm |
|
开槽 |
V-cut |
30°/45°/60° |
|
最小BGA焊盘 |
Min.BGA PAD |
14mil |
|
PCB交流阻抗控制 |
Impedance control PCB |
≤50Ω ±5Ω |
|
＞50Ω ±10% |
|
阻焊层最小桥宽 |
Soldemask Layer Min.Bridge width |
5mil |
|
阻焊膜最小厚宽 |
Soldemask film Min.Thickness |
10mil |
|
绝缘电阻 |
Insulation Resistance |
1012Ω(常态)Normal |
|
抗剥强度 |
Peel-off Strength |
1.4N/mm |
|
阻焊剂硬度 |
Soldemask Abrasion |
>5H |
|
热衡击测试 |
Soldexability Test |
260℃20(秒)second |
|
通断测试电压 |
E-test Voltage |
50-250V |
|
介质常数 |
Permitivity |
ε=2.1~10.0 |
|
体积电阻 |
Volume resistance |
1014Ω-m,ASTM D257,IEC60093 |
|
SMT焊接最小间距 |
SMT Jointing Min.Space |
0.20mm |
|
QFP间距 |
QFP Space |
pitch 0.3mm |
|
最小封装 |
Min.Package |
201 |
|
最小板面积 |
Min.Size |
50mm x 50mm |
|
最大板面积 |
Max.size |
500mm x 500mm |
|
贴片精度 |
Placement precision |
±0.01mm |
|
贴片范围 |
Placement rang |
QFP,SOP,PLCC,BGA |
|
贴装能力 |
Placement capability |
805,060,304,020,201 |
|
柔性板 |
Flexible |
1-6L |
|
最小线宽/间距 |
Min.Line Width/Space |
0.075mm |
|
最小孔径 |
Min.Hole Size |
0.20mm |
|
外形公差 |
Outline Tolerance |
±0.1mm |
|
表面处理 |
Surfce treatment on Terminal and Area |
HASL；HAL；Imersion Tin;ENIG,OSP |
|
品质标准 |
Quality Standard |
IPC-A-600F/MIL-STD-105D |
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